Sangam: A Confluence of Knowledge Streams

High‐performance top‐gate a‐Si:H TFTs for AMLCDs

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dc.contributor University of Michigan, Center for Display Technology and Manufacturing, Department of Electrical Engineering and Computer Science, Ann Arbor, MI 48109
dc.contributor Hosiden and Philips Display Corp. 3‐1, Takatsukadai, 4‐chome, Nishi‐ku, Kobe City, Hyogo, 651‐22, Japan
dc.creator Chiang, Chun‐sung
dc.creator Martin, Sandrine
dc.creator Nahm, Jeong‐yeop
dc.creator Kanicki, Jerzy
dc.creator Ugai, Yasuhiro
dc.creator Yukawa, Teizo
dc.creator Takeuchi, Shu
dc.date 2012-07-12T17:24:27Z
dc.date 2012-07-12T17:24:27Z
dc.date 1998-05
dc.date.accessioned 2022-05-19T13:31:03Z
dc.date.available 2022-05-19T13:31:03Z
dc.identifier Chiang, Chun‐sung ; Martin, Sandrine; Nahm, Jeong‐yeop ; Kanicki, Jerzy; Ugai, Yasuhiro; Yukawa, Teizo; Takeuchi, Shu (1998). "Highâ performance topâ gate aâ Si:H TFTs for AMLCDs." SID Symposium Digest of Technical Papers 29(1). <http://hdl.handle.net/2027.42/92080>
dc.identifier 0097-966X
dc.identifier 2168-0159
dc.identifier http://hdl.handle.net/2027.42/92080
dc.identifier 9726003
dc.identifier 10.1889/1.1833773
dc.identifier SID Symposium Digest of Technical Papers
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dc.identifier.uri http://localhost:8080/xmlui/handle/CUHPOERS/117418
dc.description High‐performance top‐gate hydrogenated amorphous silicon (a‐Si:H) thin‐film transistor (TFT) structures have been fabricated over a large area from plasma‐enhanced chemical vapor deposition (PECVD) materials. The electrical performances of the top‐gate a‐Si:H TFT (μ FE ≅0.75cm 2 /Vsec, V T ≅3.5V, S ≅0.55V/dec) are comparable to the electrical performances observed for an inverted‐staggered bottom‐gate a‐Si:H TFT. We have shown that the TFT field‐effect mobility first increases with the a‐Si:H thickness, and then decreases for thicker a‐Si:H films. This change of the electrical performances can be associated either with the variation of a‐Si:H microstructure with film thickness during the PECVD processes or a large density of TFT back interface states; it also involves the source/drain parasitic access resistances, especially for thick a‐Si:H layers.
dc.description Peer Reviewed
dc.description http://deepblue.lib.umich.edu/bitstream/2027.42/92080/1/1.1833773.pdf
dc.format application/pdf
dc.publisher Blackwell Publishing Ltd
dc.publisher Wiley Periodicals, Inc.
dc.rights IndexNoFollow
dc.subject Electrical Engineering
dc.subject Engineering
dc.title High‐performance top‐gate a‐Si:H TFTs for AMLCDs
dc.type Article


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