Sangam: A Confluence of Knowledge Streams

Dielectric reliability in GaN metal-insulator-semiconductor high electron mobility transistors

Show simple item record

dc.contributor Jesús A. del Alamo
dc.contributor Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science.
dc.contributor Massachusetts Institute of Technology. Department of Electrical Engineering and Computer Science.
dc.creator Lee, Ethan S
dc.date 2019-02-14T15:21:48Z
dc.date 2019-02-14T15:21:48Z
dc.date 2018
dc.date 2018
dc.date.accessioned 2022-05-04T06:07:11Z
dc.date.available 2022-05-04T06:07:11Z
dc.identifier http://hdl.handle.net/1721.1/120368
dc.identifier 1083762765
dc.identifier.uri http://localhost:8080/xmlui/handle/CUHPOERS/1250
dc.description Thesis: S.M., Massachusetts Institute of Technology, Department of Electrical Engineering and Computer Science, 2018.
dc.description This electronic version was submitted by the student author. The certified thesis is available in the Institute Archives and Special Collections.
dc.description Cataloged from student-submitted PDF version of thesis.
dc.description Includes bibliographical references (pages 73-74).
dc.description GaN Metal Insulator Semiconductor High Electron Mobility Transistors (GaN MIS-HEMTs) show excellent promise as high voltage power transistors that can operate efficiently at high temperatures and frequencies. However, current GaN technology faces several obstacles, one of which is Time-Dependent Dielectric Breakdown (TDDB) of the gate dielectric. Under prolonged electrical stress, the gate dielectric suffers a catastrophic breakdown that renders the transistor useless. Understanding the physics behind gate dielectric breakdown and accurately estimating the average time to failure of the dielectric are of critical importance. TDDB is conventionally studied under DC conditions. However, as actual device operation in power circuits involves rapid switching between on and off states, it is important to determine if estimations done from DC stress results are accurate. Due to the rich dynamics of the GaN MIS-HEMT system such as electron trapping and carrier accumulation at the dielectric/AlGaN interface, unaccounted physics might be introduced under AC stress that may cause error in DC estimation. To this end, we characterize TDDB behavior of GaN MIS-HEMTs at both DC stress conditions and more accurate AC stress conditions. We find that TDDB behavior is improved for AC stress compared to DC stress conditions at high stress frequencies. At 100 kHz, the average dielectric breakdown time is twice the average dielectric breakdown time under DC stress conditions. Furthermore, the impact of tensile mechanical stress on TDDB under DC stress is investigated. This is an important concern because of the piezoelectric nature of GaN and the substantial lattice mismatch between Si, GaN and AlGaN that results in high mechanical strain in the active portion of the device. If mechanical stress significantly impacts TDDB, designers will have to work with further constraints to ensure minimal stress across the dielectric. To address this, we have carried out measurements of TDDB under [epsilon] = 0.29% tensile strain. We find that TDDB in both the On-state and Off-state stress conditions are unaffected by this mechanical stress. Through measurements done in this thesis, we gather further insight towards understanding the physics behind TDDB. Through AC stress we find that the dynamics of the GaN MIS-HEMTs prolong dielectric breakdown times. Through mechanical stress we find that modulation of the 2-Dimensional Electron Gas and dielectric bond straining have minimal impact on TDDB.
dc.description by Ethan S. Lee.
dc.description S.M.
dc.format 74 pages
dc.format application/pdf
dc.language eng
dc.publisher Massachusetts Institute of Technology
dc.rights MIT theses are protected by copyright. They may be viewed, downloaded, or printed from this source but further reproduction or distribution in any format is prohibited without written permission.
dc.rights http://dspace.mit.edu/handle/1721.1/7582
dc.subject Electrical Engineering and Computer Science.
dc.title Dielectric reliability in GaN metal-insulator-semiconductor high electron mobility transistors
dc.title Dielectric reliability in gallium nitride metal-insulator-semiconductor high electron mobility transistors
dc.type Thesis


Files in this item

Files Size Format View
1083762765-MIT.pdf 4.349Mb application/pdf View/Open

This item appears in the following Collection(s)

  • DSpace@MIT [2699]
    DSpace@MIT is a digital repository for MIT's research, including peer-reviewed articles, technical reports, working papers, theses, and more.

Show simple item record

Search DSpace


Advanced Search

Browse