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Measurement of thermal conductivity of epoxy resins during cure

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dc.creator Struzziero, G.
dc.creator Remy, B.
dc.creator Skordos, Alexandros A.
dc.date 2018-11-14T15:32:43Z
dc.date 2018-11-14T15:32:43Z
dc.date 2018-08-28
dc.date.accessioned 2022-05-25T16:39:50Z
dc.date.available 2022-05-25T16:39:50Z
dc.identifier Struzziero G, Remy B, Skordos AA. (2019) Measurement of thermal conductivity of epoxy resins during cure. Journal of Applied Polymer Science, Volume 136, Issue 5, February 2019, Article number 47015
dc.identifier 0021-8995
dc.identifier https://doi.org/10.1002/app.47015
dc.identifier http://dspace.lib.cranfield.ac.uk/handle/1826/13640
dc.identifier.uri http://localhost:8080/xmlui/handle/CUHPOERS/182494
dc.description This work reports the development of a methodology for the measurement of thermal conductivity of thermosetting polymers during their cure. The study addresses the reliability and robustness of the method through FEA modeling and testing using a noncuring material with known thermal conductivity. The thermal conductivity and its evolution during the cure has been measured for three widely used aerospace epoxy resins, namely, RTM6, 890RTM, and the XU3508/XB3473 system as function of cure temperature. A constitutive model expressing the dependence of thermal conductivity on the degree of cure and temperature has been established. The device developed here can measure thermal conductivity of epoxy resin with accuracy up to 3%.
dc.language en
dc.publisher Wiley
dc.rights Attribution 4.0 International
dc.rights http://creativecommons.org/licenses/by/4.0/
dc.title Measurement of thermal conductivity of epoxy resins during cure
dc.type Article


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