Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits.

dc.contributor	William Davis, Chair
dc.contributor	Paul Franzon, Member
dc.contributor	Michael Steer, Member
dc.contributor	Donald Bitzer, Member
dc.creator	Melamed, Samson
dc.date	2011-07-01T07:00:16Z
dc.date	2011-07-01T07:00:16Z
dc.date	2011-04-29
dc.date	2011-04-29
dc.date	2011-06-29
dc.date	2011-04-29
dc.date	2011-07-01
dc.date	2011-05-06
dc.date.accessioned	2023-02-28T17:08:39Z
dc.date.available	2023-02-28T17:08:39Z
dc.identifier	deg807
dc.identifier	http://www.lib.ncsu.edu/resolver/1840.16/6977
dc.identifier.uri	http://localhost:8080/xmlui/handle/CUHPOERS/265727
dc.rights
dc.title	Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits.

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