Sangam: A Confluence of Knowledge Streams

Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits.

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dc.contributor William Davis, Chair
dc.contributor Paul Franzon, Member
dc.contributor Michael Steer, Member
dc.contributor Donald Bitzer, Member
dc.creator Melamed, Samson
dc.date 2011-07-01T07:00:16Z
dc.date 2011-07-01T07:00:16Z
dc.date 2011-04-29
dc.date 2011-04-29
dc.date 2011-06-29
dc.date 2011-04-29
dc.date 2011-07-01
dc.date 2011-05-06
dc.date.accessioned 2023-02-28T17:08:40Z
dc.date.available 2023-02-28T17:08:40Z
dc.identifier deg807
dc.identifier http://www.lib.ncsu.edu/resolver/1840.16/6977
dc.identifier.uri http://localhost:8080/xmlui/handle/CUHPOERS/265728
dc.rights
dc.title Junction-Level Thermal Analysis of Three Dimensional Integrated Circuits.


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