Sangam: A Confluence of Knowledge Streams

Measurement and Process Control in Precision Hot Embossing

Show simple item record

dc.contributor Massachusetts Institute of Technology. Department of Mechanical Engineering
dc.contributor Massachusetts Institute of Technology. Laboratory for Manufacturing and Productivity
dc.contributor Bageant, Maia R
dc.creator Hardt, David E.
dc.creator Bageant, Maia R
dc.date 2017-05-02T18:03:53Z
dc.date 2017-05-02T18:03:53Z
dc.date 2015-11
dc.date.accessioned 2023-03-01T18:11:18Z
dc.date.available 2023-03-01T18:11:18Z
dc.identifier 978-0-7918-5618-5
dc.identifier http://hdl.handle.net/1721.1/108600
dc.identifier Bageant, Maia R., and David E. Hardt. “Measurement and Process Control in Precision Hot Embossing.” ASME 2013 International Mechanical Engineering Congress and Exposition, 15-21 November, 2013, San Diego, California, USA, ASME, 2013. © 2013 by ASME
dc.identifier https://orcid.org/0000-0002-9053-6882
dc.identifier.uri http://localhost:8080/xmlui/handle/CUHPOERS/279082
dc.description Microfluidic technologies hold a great deal of promise in advancing the medical field, but transitioning them from research to commercial production has proven problematic. We propose precision hot embossing as a process to produce high volumes of devices with low capital cost and a high degree of flexibility. Hot embossing has not been widely applied to precision forming of hard polymers at viable production rates. To this end we have developed experimental equipment capable of maintaining the necessary precision in forming parameters while minimizing cycle time. In addition, since equipment precision alone does not guarantee consistent product quality, our work also focuses on real-time sensing and diagnosis of the process. This paper covers both the basic details for a novel embossing machine, and the utilization of the force and displacement data acquired during the embossing cycle to diagnose the state of the material and process. The precision necessary in both the forming machine and the instrumentation will be covered in detail. It will be shown that variation in the material properties (e.g. thickness, glass transition temperature) as well as the degree of bulk deformation of the substrate can be detected from these measurements. If these data are correlated with subsequent downstream functional tests, a total measure of quality may be determined and used to apply closed-loop cycle-to-cycle control to the entire process. By incorporating automation and specialized precision equipment into a tabletop “microfactory” setting, we aim to demonstrate a high degree of process control and disturbance rejection for the process of hot embossing as applied at the micron scale.
dc.description Singapore-MIT Alliance. Manufacturing Systems and Technology Programme
dc.format application/pdf
dc.language en_US
dc.publisher American Society of Mechanical Engineers (ASME)
dc.relation http://dx.doi.org/10.1115/IMECE2013-65788
dc.relation Proceedings of the ASME 2013 International Mechanical Engineering Congress and Exposition IMECE2013
dc.rights Article is made available in accordance with the publisher's policy and may be subject to US copyright law. Please refer to the publisher's site for terms of use.
dc.source American Society of Mechanical Engineers (ASME)
dc.title Measurement and Process Control in Precision Hot Embossing
dc.type Article
dc.type http://purl.org/eprint/type/ConferencePaper


Files in this item

Files Size Format View
Hardt_Measurement and process.pdf 866.9Kb application/pdf View/Open

This item appears in the following Collection(s)

Show simple item record

Search DSpace


Advanced Search

Browse