Sangam: A Confluence of Knowledge Streams

The Role of Electric Pressure/Stress Suppressing Pinhole Defect on Coalescence Dynamics of Electrified Droplet

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dc.contributor Biomedical Engineering and Mechanics
dc.creator Lee, Jaehyun
dc.creator Esmaili, Ehsan
dc.creator Kang, Giho
dc.creator Seong, Baekhoon
dc.creator Kang, Hosung
dc.creator Kim, Jihoon
dc.creator Jung, Sunghwan
dc.creator Kim, Hyunggun
dc.creator Byun, Doyoung
dc.date 2021-05-14T13:13:22Z
dc.date 2021-05-14T13:13:22Z
dc.date 2021-04-25
dc.date 2021-05-13T14:32:32Z
dc.date.accessioned 2023-03-01T18:54:42Z
dc.date.available 2023-03-01T18:54:42Z
dc.identifier Lee, J.; Esmaili, E.; Kang, G.; Seong, B.; Kang, H.; Kim, J.; Jung, S.; Kim, H.; Byun, D. The Role of Electric Pressure/Stress Suppressing Pinhole Defect on Coalescence Dynamics of Electrified Droplet. Coatings 2021, 11, 503.
dc.identifier http://hdl.handle.net/10919/103282
dc.identifier https://doi.org/10.3390/coatings11050503
dc.identifier.uri http://localhost:8080/xmlui/handle/CUHPOERS/281858
dc.description The dimple occurs by sudden pressure inversion at the droplet’s bottom interface when a droplet collides with the same liquid-phase or different solid-phase. The air film entrapped inside the dimple is a critical factor affecting the sequential dynamics after coalescence and causing defects like the pinhole. Meanwhile, in the coalescence dynamics of an electrified droplet, the droplet’s bottom interfaces change to a conical shape, and droplet contact the substrate directly without dimple formation. In this work, the mechanism for the dimple’s suppression (interfacial change to conical shape) was studied investigating the effect of electric pressure. The electric stress acting on a droplet interface shows the nonlinear electric pressure adding to the uniform droplet pressure. This electric stress locally deforms the droplet’s bottom interface to a conical shape and consequentially enables it to overcome the air pressure beneath the droplet. The electric pressure, calculated from numerical tracking for interface and electrostatic simulation, was at least <inline-formula><math xmlns="http://www.w3.org/1998/Math/MathML" display="inline"><semantics><mrow><msup><mrow><mn>10</mn></mrow><mn>8</mn></msup></mrow></semantics></math></inline-formula> times bigger than the air pressure at the center of the coalescence. This work helps toward understanding the effect of electric stress on droplet coalescence and in the optimization of conditions in solution-based techniques like printing and coating.
dc.description Published version
dc.format application/pdf
dc.format application/pdf
dc.language en
dc.publisher MDPI
dc.rights Creative Commons Attribution 4.0 International
dc.rights http://creativecommons.org/licenses/by/4.0/
dc.subject droplet coalescence
dc.subject spray coating
dc.subject charged droplet
dc.subject pinhole defect
dc.subject air film layer
dc.title The Role of Electric Pressure/Stress Suppressing Pinhole Defect on Coalescence Dynamics of Electrified Droplet
dc.title Coatings
dc.type Article - Refereed
dc.type Text
dc.type StillImage


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